14 Oct 2024
14 October 2024
To: Interested Suppliers
Invitation to Tender – Building Condition Survey Services for the Singapore Embassy in Phnom Penh
PNH/ITT/2024/001
The Embassy of Singapore in Phnom Penh would like to invite interested companies to submit a tender proposal for Building Condition Survey Services for the Singapore Embassy.
The proposal should be submitted by sealed envelope, in line with the instructions provided, to the Embassy and addressed to Mr Ong Wei Jie, Attaché (Admin and Technical) no later than 1600hrs (UTC +7) on 29 November 2024.
To obtain the Tender documents or any enquiries regarding to the Invitation to Tender, please contact:
Ong Wei Jie
Email: ong_wei_jie@mfa.gov.sg
Novene Li
Email: Novene_li@mfa.gov.sg
The Tender Schedule and Award Notice will be published at the public notice board at the Singapore Embassy.